UCSP: Micro (μ) or Ultra Chip Scale Package (CSP)

UCSP: Micro (μ) or Ultra Chip Scale Package (CSP)

Micro (μ) or Ultra Chip Scale Package (UCSP) is a packaging technology that eliminates the traditional plastic package used to encapsulate integrated circuits (ICs).

PDF) Organic Chip Scale Package (CSP) Development for Flip Chip

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PDF) Organic Chip Scale Package (CSP) Development for Flip Chip